Intermetallic compounds growth between Sn-3.5Ag lead-free solder and Cu substrate by dipping methodYU, D. Q; WU, C. M. L; LAW, C. M. T et al.Journal of alloys and compounds. 2005, Vol 392, pp 192-199, issn 0925-8388, 8 p.Article

The properties of Sn-9Zn lead-free solder alloys doped with trace rare earth elementsWU, C. M. L; YU, D. Q; LAW, C. M. T et al.Journal of electronic materials. 2002, Vol 31, Num 9, pp 921-927, issn 0361-5235Article

Properties of lead-free solder alloys with rare earth element additionsWU, C. M. L; YU, D. Q; LAW, C. M. T et al.Materials science & engineering. R, Reports. 2004, Vol 44, Num 1, pp 1-44, issn 0927-796X, 44 p.Article

Microstructure, solderability, and growth of intermetallic compounds of Sn-Ag-Cu-Re lead-free solder alloys : Phase stability, formation and transformation of electronic materialsLAW, C. M. T; WU, C. M. L; YU, D. Q et al.Journal of electronic materials. 2006, Vol 35, Num 1, pp 89-93, issn 0361-5235, 5 p.Conference Paper

The formation of none-Ag₃Sn particles on the intermetallic compounds during wetting reactionYU, D. Q; WANG, L; WU, C. M. L et al.Journal of alloys and compounds. 2005, Vol 389, pp 153-158, issn 0925-8388, 6 p.Article

The wettability and microstructure of Sn-Zn-RE alloysWU, C. M. L; LAW, C. M. T; YU, D. Q et al.Journal of electronic materials. 2003, Vol 32, Num 2, pp 63-69, issn 0361-5235, 7 p.Article

Microstructure and mechanical properties of new lead-free Sn-Cu-RE solder alloysWU, C. M. L; YU, D. Q; LAW, C. M. T et al.Journal of electronic materials. 2002, Vol 31, Num 9, pp 928-932, issn 0361-5235Article